助焊剂都符合IPCJ-STD-006和JISZ3283AA级/A级标准.具有免清洗，透明残留少，烟雾小,不易飞溅的特点.
助焊剂含量:1.2%到3.5%。普通焊接，建议助焊剂含量2.2%。
良好的扩散性，耐热和热疲劳特性强，对焊盘及烙铁头腐蚀极少，
线径根据需要定制：直径：0.1mm/0.15mm/0.2mm/0.3mm/0.4mm/0.5mm/0.6mm/0.8mm/1.0mm或更大。
此外，根据要求订制各种合金：Sn42Bi58/ Sn43Bi43Pb14/ Sn10Pb88Ag2/ Sn95Sb5/ Sn90Sb10/ 等 。
Section 2. Composition/information on ingredients | |||
Name | CAS # No. | Weight % | Toxicity Data ( LC50/LD50, TLV) |
1) Tin 2) Silver 3) Copper 4)Modified rosin
| 7440-31-5 7440-22-4 7440-50-8 65997-06-0
| Remainder 0.28-0.32 0.60-0.80 2.75-3.25
| TWA: 2 (mg/m3) from ACGIH (TLV) [United States] [1994] INHALATION Respirable TWA: 0.1 (mg/m3) from NIOSH [United States] [1994] INHALATION TWA: 15 (mg/m3) from OSHA (PEL) [United States] INHALATION Respirable ORAL (LD50): Acute: 1400 mg/kg [Rat]. 2600 mg/kg [Rabbit]. 1900 mg/kg [Mouse] ORAL (LD50): Acute: 2400 mg/kg [Mouse]. 5660 mg/kg [Rat]. 2400 mg/kg [Mouse]. DERMAL (LD50): Acute: 4120 mg/kg [Rabbit]. |
Elements | Specification(%wt/wt) | |
Tin | Sn | Remainder |
Copper | Cu | 0.60-0.80 |
Nickel | Ni | Max0.050 |
Lead | Pb | Max0.050 |
Aluminium | Al | Max0.005 |
Antimony | Sb | Max0.100 |
Arsenic | As | Max0.030 |
Bismuth | Bi | Max0.050 |
Iron | Fe | Max0.010 |
Zinc | Zn | Max0.003 |
Cadmium | Cd | Max0.005 |
Indium | In | Max0.050 |
Gold | Au | Max0.050 |
CHEMICAL COMPOSITION OF FLUX
The standard flux content for this type of solder wire is 2.5+/-0.2%.However, other percentages of
flux are available upon request. The range for the flux percentage is 2.2%-3.3%
CHARACTERISTIC OF CORED FLUX
Feature
| Requirements for Flux EN 14582 | FN110
|
Flux Type | No Clean | |
Flux Content | 2.2% to 3.3% | |
Color/Appeara nce | Clear | |
Melting Range | 226℃ | |
Odor | Mild | |
Dryness | Chalk powder shall be easily removed from any test piece | Passed
|
Chloride Content(%) | Max 50ppm | N.D |
Copper Plate Corrosion | Any test piece shall not show greater corrosion compared with a reference test piece | Passed
|
Surface Insulation Resistance (Ohm) Before Humidifying | 1.5 × 10 13 ohm | |
Surface Insulation Resistance (Ohm) After Humidifying | 1 × 10 9 ohm Min | 1 × 10 12 ohm |
Spreadability(%) | 75% Min | >82% |
焊锡发展的进程
人类发明了电以后，电子电器产品开始高速的发展，进入二十一世纪电子电器更是跟生活息息相关，对产品的追求也是越来越高要求，精密小巧，高性价比，而且电子产品里用的材质也在不断的更新，从最开始的锡铅合金材料到无铅环保的进步，让后续人类环境可以得以筵续。
随着市场需求的更新和改善，也要求焊锡产品紧跟时代的脚步，与时具进，才不至于给市场淘汰掉，所以现在的无铅环保锡铜，锡银铜，锡铜镍，锡铋等等规格的合金也应用而生，生产工艺的不断进步要求，推动着焊锡产品也跟着进步，焊点越来越小，机器化焊接的广泛应用同是衍生了0.15MM，0.2MM等精细焊锡。
人类是在不断的进步，电子产品不断的更新，焊锡也会紧跟着进步。